A team of Lehigh University researchers has successfully predicted abnormal grain growth in simulated polycrystalline materials for the first time—a development that could lead to the creation of stronger, more reliable materials for high-stress environments, such as combustion engines. A paper describing their novel machine learning method was recently published in Nature Computational Materials.

Multicolored optical switching is essential for potential advancements in telecommunication and optical computing. However, most materials typically exhibit only single-colored optical nonlinearity under intense laser illumination. To address this, researchers have demonstrated that exciting the multivalley semiconductor germanium with a single-color pulse laser enables ultrafast transparency switching across multiple wavelengths. This breakthrough could drive the development of ultrafast optical switches for future multiband communication and optical computing.

A research team led by Professor Tong Zhang from the Department of Civil Engineering of Faculty of Engineering at the University of Hong Kong (HKU) has developed a computational tool, Argo, designed to accurately track ARGs in environmental samples, providing insights into their dissemination and associated risks.

The Inter-University Research Institute Corporation Research Organization of Information and Systems, National Institute of Informatics (NII) expanded the bandwidth of all international communication lines connecting Japan, the US, and Europe in the Science Information NETwork SINET6, to 400 Gbps. The upgraded network started operation in April 2025.

The "Mainland-Hong Kong-Macao Scientists Forum and Exchange Activities 2025" organised by the China Women’s Association for Science and Technology (CWAST) and co-hosted by the University of Hong Kong (HKU), was held at the HKU campus from 14 to 15 April. The forum brought together over 80 leading scientists, experts, and students to discuss the latest advancements in materials science, biochemistry, biomedicine, artificial intelligence, and engineering.