Fluorinated polyimide: High toughness and low dielectric properties pave new path for high-frequency communication materials
Peer-Reviewed Publication
Updates every hour. Last Updated: 10-Jul-2025 09:10 ET (10-Jul-2025 13:10 GMT/UTC)
Conventional polyimides (PIs) exhibit excellent thermal stability and mechanical performance, yet their dielectric properties (dielectric constant (Dk) > 3.2, dissipation factor (Df) > 0.005 @ 10 GHz). In previous reports, the introduction of trifluoromethyl reduced the dielectric constant and dissipation factor, but it increased chain rigidity, weakened hydrogen bonds interaction, and reduced free volume, which definitely reduced mechanical performance (such as poor toughness leading to crack risks in advanced packaging). Therefore, it is necessary to design PI materials with high toughness and low dielectric properties to meet the demands of advanced packaging technologies evolving towards millimeter-wave frequencies and heterogeneous integration. A research team has developed a novel fluorinated polyimide that reduces the material's dielectric constant and dissipation factor while enhancing its mechanical properties. Their work is published in the journal Industrial Chemistry & Materials on 03 Jun 2025.
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