News Release

Surface/interface engineering for high‑resolution micro‑/nano‑photodetectors

Peer-Reviewed Publication

Shanghai Jiao Tong University Journal Center

Surface/Interface Engineering for High‑Resolution Micro‑/Nano‑Photodetectors

image: 

  • Surface/interface engineering can compensate for defects, adjust the bandgap, and develop novel quantum structures, which consequently optimize photovoltaic units and revolutionize optoelectronic devices.
  • This review comprehensively elaborates on the surface/interface engineering scheme of micro-/nano-photodetectors from principles, types, and parameters, and describes the influence of material selection and manufacturing techniques.
  • Surface/interface engineering continuously promotes the development of low-dimensional optoelectronic materials and drives the industrialization of flexible optoelectronic devices.
view more 

Credit: Jinlin Chang, Ting Liu*, Xiao Geng, Genting Dai, Liangliang Yang, Mingjun Cheng, Linpan Jiang, Zhenyuan Sun, Jianshe Liu, Wei Chen*.

As artificial intelligence and miniaturized electronics surge forward, conventional photodetectors struggle to deliver the resolution, speed and energy efficiency required for next-generation imaging, sensing and human–machine interaction. Now, a team led by Professor Wei Chen at Tsinghua University has published a comprehensive roadmap on surface/interface engineering that turns micro-/nano-scale photodetectors into ultra-sharp “electronic eyes”. The work appeared in Nano-Micro Letters.

Why Surface/Interface Engineering Matters
Defect Healing: Atomic-level passivation and functional-group grafting suppress interfacial traps, slashing dark current and boosting signal-to-noise ratio.
Band-gap Sculpting: van-der-Waals heterojunctions, quantum wells and strain gradients tailor the spectral window from deep-UV to long-wave infrared without extra filters.
Light-management: Elliptical gratings, pyramidal textures and plasmonic nano-cavities extend the optical path, enabling >90 % absorption in films thinner than 50 nm.
Mechanical Bridging: Hydrophobic–hydrophilic patterning and buffer layers reconcile soft organics with rigid inorganics, giving flexible devices a bending radius <1 mm while maintaining pixel pitch down to 1 µm.

Innovative Design and Features
Material Menu: 2D black phosphorus with strain-tunable bandgap, perovskite nanowire arrays for full-colour imaging, TMDC/graphene heterostacks for picosecond response, and lead-free CsSnBrx inks for green manufacturing.
Processing Toolkit: ALD-grown 1-nm Al2O3 passivation shells, EHD printing of 1 µm pixels, plasma-enhanced CVD for wafer-scale TMDCs, and self-assembled monolayers that lower interfacial traps by an order of magnitude.
Architecture Gallery: 1D nanonail forests, 2D lateral p–n heterojunctions, 3D pyramid-on-pyramid textures, and resonant cavities that fold a 1550 nm beam into a 300 nm active layer.

Applications and Future Outlook
Thermal Imaging: Passivated InGaAs/AlGaN pixel arrays resolve 20 mK temperature differences at 1 kHz frame rates for night-vision and medical diagnostics.
Flexible Wearables: Transfer-printed single-crystal perovskite sheets wrapped around a robotic finger provide 317 ppi imaging during grasping tasks.
Bio-inspired Vision: A hemispherical 1 µm-pitch nanowire retina coupled to liquid-metal nerves mimics human-eye resolution and is implantable for vision restoration.
Catalytic Sensing: TiO2/BaTiO3 core–shell nanorods double photoelectrochemical water-splitting efficiency while acting as self-powered UV monitors.

Challenges and Opportunities
The review pinpoints reproducibility of sub-10 nm interfaces, long-term stability under moist bio-environments, and CMOS-compatible pitch scaling below 200 nm as the next grand challenges. Future research will marry machine-learning-guided multi-parameter optimization with roll-to-roll nano-imprint lithography to deliver wafer-scale, defect-free electronic eyes for intelligent systems.

This comprehensive roadmap offers device engineers, materials scientists and circuit designers a unified vocabulary for transforming any photodetector—old or new—into a high-resolution, low-power, spectrum-agile imaging engine.


Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.