Innovative “Stamping and Stacking” method (IMAGE)

Hong Kong University of Science and Technology

Innovative “Stamping and Stacking” method

Caption

Using an innovative “Stamping and Stacking” method, the team cost-effectively fabricated porous SMA chips and assembled them into an ultra-durable elastocaloric refrigerant structure capable of withstanding more than 100 million cycles, paving the way for the large-scale deployment of elastocaloric cooling technology.

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HKUST

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