Figure 2. Evolution pathway of metasurface technologies in communication from fabrication feasibility to intelligent integration. (IMAGE)

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Expert Contacts

Yue Wang
Key Laboratory of Ultrafast Photoelectric and Terahertz Science in Shaanxi, Xi’an University of Technology, Xi’an, China.
wangyue2017@xaut.edu.cn

Xiaoguang Zhao
State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments, Tsinghua University, Beijing, China.
zhaoxg@mail.tsinghua.edu.cn

Kuang Zhang
Department of Microwave Engineering, Harbin Institute of Technology, Harbin, China.
zhangkuang@hit.edu.cn

Zheng You
State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instruments, Tsinghua University, Beijing, China.
yz-dpi@mail.tsinghua.edu.cn

Figure 2. Evolution pathway of metasurface technologies in communication from fabrication feasibility to intelligent integration. (IMAGE)

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