Fig. 2. Temperature difference caused by chips position and fluid flow. (IMAGE)

CES Transactions on Electrical Machines and Systems

Fig. 2. Temperature difference caused by chips position and fluid flow.

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So far, optimization methods for irregular Pinfin layouts are not clearly investigated. To address this issue, the author’s team has proposed the possibility of optimizing the design of

irregularly arranged Pinfin structures, as depicted in Fig. 8. In this method, the primary objective of heat dissipation optimization is to reduce the thermal resistance of the powe module, and simutaneously minimize the temperature difference among the chip junctions as much as possible.  https://doi.org/10.30941/CESTEMS.2024.00041

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CES Transactions on Electrical Machines and Systems (CES TEMS)

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