A new approach to superconducting integrated circuits: Dual-active-layer design compresses time paths and enhances computational performance
Peer-Reviewed Publication
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Updates every hour. Last Updated: 10-Nov-2026 14:16 ET (10-Nov-2026 19:16 GMT/UTC)
A research team at the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences has proposed a method for optimizing superconducting integrated circuits based on “time scaling”. By constructing a dual-active-device layer within a single wafer, the researchers successfully transformed key logic paths from planar structures into vertically compressed ones, significantly reducing pulse propagation time and paving a new path for superconducting computing in the post-Moore’s Law era.
In a paper published in Acta Mathematica Scientia, a research team from Shandong University, Tsinghua University, and Purdue University has made progress in bubbling analysis of a class of fourth-order geometric elliptic systems in the critical dimension. In their main result, they established the angular energy quantization for the inhomogeneous Lamm-Rivière system in four dimensions, with an inhomogeneous term merely in LlogL. This work provides critical insight in the mechanism of “bubble” formations and concentration-compactness phenomena for higher-order geometric variational problems.