Figure Abstract (IMAGE)

Dalian Institute of Chemical Physics, Chinese Academy Sciences

Figure Abstract

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CuAu alloys with tailored compositions were integrated onto copper foam by a simple one-step electrodeposition method. The optimized Cu0.25Au0.75 catalyst exhibited rather excellent performance for the electrocatalytic oxidation of 5-hydroxymethylfurfural (HMF) via a one-electron dehydrogenation pathway. The improved catalytic activity could be attributed to the alloying-induced charge redistribution that modulates the d-band centers, thereby steering surface adsorption behaviors to balance HMF adsorption and HMFCA desorption, ensuring active site availability for the selective production of 5-hydroxymethyl-2-furancarboxylic acid (HMFCA) and simultaneous anodic hydrogen evolution.

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Chinese Journal of Catalysis

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