Hierarchical Modular Architecture Enabling Intelligent Dynamic Thermal Management and Superior Electromagnetic Interference Shielding (IMAGE)
Caption
- Hierarchical modular architecture for integrated design and functional optimization.
- Development of an intelligent monitoring and feedback-driven thermal management system, providing not only stable and sensitive front-end temperature and humidity monitoring, but also low-power thermoelectric (1.5 V, 51.79 °C) and photothermal (45.51 mW cm-2, 56.38 °C) dual complementary temperature control capabilities for the back end.
- Multiscale and scalable conductive gradient for exceptional electromagnetic interference shielding performance (35 μm, 1600 dB mm-1), ensuring stable signal transmission across the system.
Credit
Qi-Fan Xuan, Pei-Yan Zhao, Hualong Peng, Shan Zhang, Bo Cai, Fang-Yu Niu, Martin C. Koo, Xiao-Bo Sun, Xiangyu Jiang*, Guang-Sheng Wang*.
Usage Restrictions
Credit must be given to the creator. Only noncommercial uses of the work are permitted. No derivatives or adaptations of the work are permitted.
License
CC BY-NC-ND