A Hierarchical Short Microneedle‑Cupping Dual‑Amplified Patch Enables Accelerated, Uniform, Pain‑Free Transdermal Delivery of Extracellular Vesicles (IMAGE)
Caption
- A bio-inspired dual-amplified patch (MN@EV/SC) was fabricated by integrating extracellular vesicle-loaded microneedles with a soft suction chamber for effective transdermal delivery.
- The MN@EV/SC system achieved an exceptional penetration depth of 290 μm, while minimizing plasma corticosterone levels with short microneedles, ensuring patient comfort through pain-free application.
- This system showed the potential for dermatological application by revitalizing dermal fibroblasts, and enhancing collagen synthesis through effective delivery of extracellular vesicles while preserving their biological functionality.
Credit
Minwoo Song, Minji Ha, Sol Shin, Minjin Kim, Soyoung Son, Jihyun Lee, Gui Won Hwang, Jeongyun Kim, Van Hieu Duong, Jae Hyung Park, Changhyun Pang.
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Credit must be given to the creator. Only noncommercial uses of the work are permitted. No derivatives or adaptations of the work are permitted.
License
CC BY-NC-ND