High-efficiency-sustainable grinding by integration of UVAG, HPGW and MQL (IMAGE)
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UVAG can reduce heat generation during grinding by altering the proportion of the chip formation three stages. Meanwhile, HPGWs with MQL can facilitate rapid heat dissipation in the high efficiency grinding. Therefore, the integration of UVAG, HPGWs, and MQL, as well as the ternary collaborative regulation based on the intelligence sensing of grinding process is expected to achieve the goal of temperature control, energy and carbon emission reduction.
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Chinese Journal of Aeronautics
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