A practical route to low-loss integrated quantum photonic chips
Peer-Reviewed Publication
Updates every hour. Last Updated: 19-Oct-2026 23:17 ET (20-Oct-2026 03:17 GMT/UTC)
Quantum photonic chips could transform future quantum networks and quantum computers, but the best quantum emitters and photonic materials are difficult to combine without losing light. A self-aligned heterogeneous photonic integration method overcomes this barrier by joining diamond quantum emitters and spins with integrated photonics at low insertion loss, advancing scalable quantum photonic technologies.
Roboticists at the UCLA Samueli School of Engineering and the University of Michigan have shown that elastic rods can be bent and twisted to repeatedly snap between shapes, releasing built-up energy that enables small robots to hop, flip and swim. The study, published in Science Advances, could offer a promising new approach to movement for robots constrained by size, weight and power output. The snapping mechanism could also help robots move across uneven terrain, on land and in water.
Researchers have engineered a new material that is an extreme thermal insulator, is exceptionally stiff, and can be printed as a thin film at large scales. The material has one of the lowest thermal conductivity profiles of any dense, or non-porous, material – approaching the theoretical limit of how good a material can be as a thermal insulator.
Five University of Texas at Dallas faculty members received 2026 Faculty Early Career Development Program (CAREER) awards from the National Science Foundation to support research aimed at making computer networks more resilient, developing next-generation electronics, strengthening software security and advancing mathematical understanding of complex systems.
The recipients of the five-year awards are Dr. Waseem Abbas, assistant professor of systems engineering; Dr. Sourav Dutta, assistant professor of electrical and computer engineering; Dr. Kirill Lazebnik, assistant professor of mathematical sciences; Dr. Kyle McCall, assistant professor of materials science and engineering; and Dr. Xinda Wang, assistant professor of computer science.